发明名称 Method of preventing semiconductor layers from bending and seminconductor device formed thereby
摘要 Disclosed herein are various methods for preventing bending of a patterned SOI layer during trench sidewall oxidation, the methods comprising providing a patterned SOI layer having at least one trench, said patterned SOI layer disposed upon an underlying buried silicon oxide layer; and blocking diffusion of oxygen between said patterned SOI and buried silicon oxide layer.
申请公布号 US2002022308(A1) 申请公布日期 2002.02.21
申请号 US20010861443 申请日期 2001.05.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN DONG-HO;KANG HO-KYU;BAE GEUM-JONG
分类号 H01L21/76;H01L21/265;H01L21/316;H01L21/762;H01L27/12;H01L29/786;(IPC1-7):H01L21/00;H01L21/84;H01L21/823;H01L21/336;H01L21/331;H01L21/822 主分类号 H01L21/76
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