Kühlvorrichtung für elektronische Bauteile und Verfahren zur Herstellung der Kühlvorrichtung

摘要

The invention relates to a cooling device for electronic components. Said cooling device (5) comprises a cooling surface (3) and is larger than the sum of the top surfaces of the electronic components to be cooled. To this end, the cooling device (5) comprises at least one cooling panel (6) coated with a thermoconducting material (7) and a pressing device by means of the which the contours of the top surfaces to be cooled are pressed into the thermoconducting coating (7). The invention further relates to a method for producing a cooling device (5).