发明名称 HEAT RESISTANT RESIN COMPOSITION, A HEAT RESISTANT FILM OR SHEET THEREOF AND A LAMINATE COMPRISING THE FILM OR THE SHEET AS A SUSBSTRATE
摘要 A heat resistant resin composition comprising 70 to 30 wt % of a crystalline polyarylketone resin having a peak melting temperature of crystal of 260 DEG C or higher and 30 to 70 wt % of a noncrystalline polyetherimide resin, wherein said composition has at least 2 peaks of loss tangent(tan delta ) between 140 DEG C and 250 DEG C, determined by dynamic mechanical measurement.
申请公布号 WO0214404(A2) 申请公布日期 2002.02.21
申请号 WO2001JP06749 申请日期 2001.08.06
申请人 MITSUBISHI PLASTICS, INC.;TANIGUCHI, KOUICHIROU;YAMADA, SHINGETSU 发明人 TANIGUCHI, KOUICHIROU;YAMADA, SHINGETSU
分类号 C08J5/18;B32B15/088;C08L71/00;C08L71/08;C08L79/08;H05K1/03;H05K3/00 主分类号 C08J5/18
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