发明名称 |
PLASMA PROCESSING SYSTEM AND METHOD |
摘要 |
A plasma processing system includes a vacuum chamber having a gas introducing unit, and an electromagnetic wave introducing planar plate and electromagnets disposed in the chamber. A distance between the planar plate and a sample is equal to or less than one half of the smaller one of the diameters of the planar plate and the sample. An electromagnetic wave with a frequency ranging from 300 MHz to 500 MHz and an electromagnetic wave with a frequency ranging from 50 kHz to 30 MHz are superposed to the planar plate. Reaction between the resultant electromagnetic wave superposed and a magnetic field of the electromagnets generates plasma to achieve plasma processing of the sample.
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申请公布号 |
US2002020494(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US19990336687 |
申请日期 |
1999.06.21 |
申请人 |
YOKOGAWA KEN?APOS,ETSU;IZAWA MASARU;ITABASHI NAOSHI;NEGISHI NOBUYUKI;TACHI SHINICHI |
发明人 |
YOKOGAWA KEN?APOS,ETSU;IZAWA MASARU;ITABASHI NAOSHI;NEGISHI NOBUYUKI;TACHI SHINICHI |
分类号 |
H01L21/302;C23F4/00;H01J37/32;H01L21/3065;H01L21/311;H01L21/3213;H05H1/46;(IPC1-7):C23F1/02 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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