发明名称 |
Method for fabricating gate oxide film of semiconductor device |
摘要 |
The present invention relates to a method for fabricating a semiconductor device, and more particularly, to a method for fabricating a gate oxide film of a semiconductor device by which semiconductor devices having different electrical characteristics can be implemented in the same chip. The present invention provides a method for fabricating a gate oxide film of a semiconductor device which includes the steps of: forming a screen oxide film on the top surface of a semiconductor substrate; forming an ion implantation mask on parts of the top surface of the screen oxide film; implanting nitrogen ions into the semiconductor substrate using the ion implantation mask; removing the ion implantation mask and the screen oxide film; forming an oxide film on the top surface of the semiconductor substrate; and annealing the semiconductor substrate in a N2O or O3 atmosphere.
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申请公布号 |
US2002022376(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20010770672 |
申请日期 |
2001.01.29 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
OH JONG-HYUK |
分类号 |
H01L21/265;H01L21/28;H01L21/316;H01L21/8234;H01L29/51;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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