发明名称 Method for fabricating gate oxide film of semiconductor device
摘要 The present invention relates to a method for fabricating a semiconductor device, and more particularly, to a method for fabricating a gate oxide film of a semiconductor device by which semiconductor devices having different electrical characteristics can be implemented in the same chip. The present invention provides a method for fabricating a gate oxide film of a semiconductor device which includes the steps of: forming a screen oxide film on the top surface of a semiconductor substrate; forming an ion implantation mask on parts of the top surface of the screen oxide film; implanting nitrogen ions into the semiconductor substrate using the ion implantation mask; removing the ion implantation mask and the screen oxide film; forming an oxide film on the top surface of the semiconductor substrate; and annealing the semiconductor substrate in a N2O or O3 atmosphere.
申请公布号 US2002022376(A1) 申请公布日期 2002.02.21
申请号 US20010770672 申请日期 2001.01.29
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 OH JONG-HYUK
分类号 H01L21/265;H01L21/28;H01L21/316;H01L21/8234;H01L29/51;(IPC1-7):H01L21/31;H01L21/469 主分类号 H01L21/265
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