发明名称 |
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE |
摘要 |
A semiconductor package manufacturing method includes: providing a rerouting film; attaching a semiconductor wafer having integrated circuits to the rerouting film, such that chip pads of the integrated circuits correspond to via holes of the rerouting film; forming a solder filling in each of the via holes to electrically connect the chip pads to the metal pattern layer; forming external terminals on terminal pads of the rerouting film; and separating the wafer and the rerouting film into individual semiconductor packages. A method further includes forming a protection layer on the solder filling. Instead of the semiconductor wafer, individual integrated circuit chips can be attached on the rerouting film. The semiconductor package includes: an integrated circuit having chip pads; a substrate attached to the integrated circuit so that via holes of the substrate are above the chip pads; solder fillings inside the via holes, the solder fillings electrically connecting the chips pads to the pattern metal layer; and another dielectric layer between the substrate and the semiconductor integrated circuit. The semiconductor package further includes external terminals, interconnection bumps on the chip pads, and polymer protection layers on the solder fillings.
|
申请公布号 |
US2002022301(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20000482216 |
申请日期 |
2000.01.12 |
申请人 |
KWON YONG HWAN;KANG SA YOON;KIM NAM SEOG;JANG DONG HYEON |
发明人 |
KWON YONG HWAN;KANG SA YOON;KIM NAM SEOG;JANG DONG HYEON |
分类号 |
H01L23/538;H01L23/31;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|