发明名称 Wafersonde
摘要 The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.
申请公布号 DE20114544(U1) 申请公布日期 2002.02.21
申请号 DE2001214544U 申请日期 2001.09.04
申请人 CASCADE MICROTECH, INC. 发明人
分类号 G01R31/26;G01R1/06;G01R1/073;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R31/26
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