Contactless temperature measurement method for use during laser soldering of semiconductor chip, involves adding output of radiation thermopiles detecting surface temperature of objects, following preamplification

摘要

A pair of radiation thermopiles are aligned suitably to detect the surface temperature of an object (114). The output of the thermopiles are preamplified and added, and the resulting sum signal is further amplified. Independent claims are also included for the following: (a) Detector head for contactless temperature measurement; (b) Application of contactless temperature measurement method or detector head to laser soldering of semiconductor chips.