| 摘要 |
<p>An apparatus (10) and method for high speed, reliable and repeatable delivery and reflow of solder material (20) onto a substrate are disclosed. The apparatus (10) has a repositionable capillary (70) to direct individual solder material (20) to a specific location on the substrate. An energy source (80) is directed through the capillary (70) onto the solder to reflow the solder to the substrate. The apparatus(10) provides for individual introduction of the solder material (20) into the capillary (70) and urging of the solder material (20) from a reservoir (40) to the capillary while preventing unintended jams and blockage of the solder material (20).</p> |
