发明名称 |
Heat dissipation module for a BGA IC |
摘要 |
An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protruding annular ring is provided on the top surface of the top plate. This design can ensure the the top plate and a mold match during the capsulation process, avoid the glue overflow problem, and increase its total dissipation area to facilitate heat dissipation.
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申请公布号 |
US2002020926(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20010931086 |
申请日期 |
2001.08.15 |
申请人 |
LIU WEN-CHUN;PAN YI-HSIANG;LEE KUO-YUAN |
发明人 |
LIU WEN-CHUN;PAN YI-HSIANG;LEE KUO-YUAN |
分类号 |
H01L21/56;H01L23/31;H01L23/433;(IPC1-7):H01L29/40;H01L23/52;H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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