发明名称 Semiconductor device and manufacturing method thereof
摘要 As wiring patterns in a region for connecting two line & space pattern sets having different line & space widths on a semiconductor substrate, even-numbered line patterns in a region having a smaller line & space width are connected to line patterns in a region having a larger line & space width and thicken their line widths stepwise in the middle of the lengthwise direction, and odd-numbered line patterns in the region having the smaller line & space width terminate at different positions in a connection region. Upon forming a fine wiring pattern on the connection region using photolithography, the resolution and depth of focus can be suppressed from impairing.
申请公布号 US2002022311(A1) 申请公布日期 2002.02.21
申请号 US20010920859 申请日期 2001.08.03
申请人 TAKEUCHI YUJI;ARAI FUMITAKA 发明人 TAKEUCHI YUJI;ARAI FUMITAKA
分类号 H01L21/027;H01L21/8247;H01L23/528;H01L27/115;(IPC1-7):H01L21/823 主分类号 H01L21/027
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