| 摘要 |
An RF module (10 comprises a multi-layered substrate (12); and a base-band IC (14), a memory IC (16), a quartz oscillator (18) and surface-mount components (20) all mounted on the upper side of the multi-layered substrate. A metallic cap (22) is attached to the upper side of the multi-layered substrate (12). A cavity (24) formed in the lower side of the multi-layered substrate (12) houses a first RF-IC (26) and a second RF-IC (28). Wiring patterns (32) for connection between the base-band IC (14) and the memory IC (16), through-holes (34), RF passive components (36), and shield ground electrode pattern (38) are formed internally of the multi-layered substrate 12. An antenna may also be included in the substrate. The multilayer substrate provides a compact, reduced size RF module for use in communication devices such as a mobile phone. |
