| 摘要 |
PURPOSE: An exposure method for a semiconductor device is provided to prevent an abnormal shape formed in the edge of a wafer during an exposure process, by inserting a blank die into an empty space of a mask frame constituting a field such that the blank die has the same size as the empty space. CONSTITUTION: When a die not existing in a wafer exists in one of the fields at the edge of the wafer, the blank die is disposed in the mask frame according to the type of a corresponding die and a re-exposure process is performed regarding the blank die to eliminate the pattern in the corresponding die.
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