LEAD FRAME, SEMICONDUCTOR DEVICE MANUFACTURED BY USING THE SAME, AND ITS MANUFACTURING METHOD

摘要

PURPOSE: To provide a lead frame, which contrives to downsize a semiconductor device to be mounted, while deformation does not occur at the time of lead forming; the semiconductor device manufactured by using the same, and to provide its manufacturing method. CONSTITUTION: In a lead frame in which an element-mounting part 13 to which a semiconductor element is mounted is joined to an outer frame 11 having a reference positioning hole 16, a tie bar 12 is provided with a deformation permitting part 15 for preventing the frame from deforming which occurs in the outer frame 11.