| 摘要 |
PROBLEM TO BE SOLVED: To enhance the detection sensitivity for a defective portion in failure analysis for a semiconductor chip. SOLUTION: Since a current value is remarkably varied in a position just above the defective portion such as a wiring short circuit 1d or an element leakage 1e, coordinates at this time are transformed into scanner coordinates to enhance the detection sensitivity for the position of the defective portion, by irradiating a micro-area on a main face 1a of the semiconductor chip 1 with an infrared ray 2 through a slit of a scanning plate, by scanning the infrared ray 2 both X-directionally and Y-directionally to heat wiring 1b micro-area by micro-area, and by monitoring the current value while corresponding to the micro-area.
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