| 摘要 |
PURPOSE: A printed circuit board(PCB) is provided, which makes an inner wall of a blind via hole smooth and makes it easy to form a blind via hole having a small diameter. CONSTITUTION: After stacking an outer layer(30) on an inner layer(10), they are combined using a temperature and a pressure. Then, a blind via hole(50) is formed on the outer layer of a multi-layered printed circuit board using a laser drill. The outer layer is formed using a prepreg comprising a resin and a black type glass fiber to reduce an amount of laser emission compared to the prior white type glass fiber. Thus, an ablation difference between the resin and the glass fiber is reduced and therefore the inner wall of the blind via hole becomes smooth, and it becomes easy to form the blind via hole having a small diameter.
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