| 摘要 |
thermoelectric devices for miscellaneous cooling and heating systems. SUBSTANCE: thermoelectric module designed for use in air conditioners, refrigerators, thermostats, miscellaneous coolers of electronic equipment, and dc thermoelectric generators has a number of semiconductor thermocouples inserted between ceramic plates whose external surface is metal-plated. Coolers have projections and are welded by means of the latter with metal-plated surface of ceramic plate to form non-split joint between them. Proposed design ensures elimination of mechanical stresses at cooler-to-ceramic-plate joint that may otherwise occur in case of module temperature variations due to difference in linear coefficients of thermal expansion of metal and ceramic material. EFFECT: enhanced efficiency of heat transfer and mechanical strength of module. 5 cl, 13 dwg |
