| 发明名称 |
Slurry for mechanical polishing (CMP) of metals and use thereof |
| 摘要 |
Slurry compositions comprising an oxidizing agent, copper corrosion inhibitor, abrasive particles; surface active agent and polyelectrolyte are useful for polishing or planarizing chip interconnect/wiring material such as Al, W and especially Cu.
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| 申请公布号 |
US6348076(B1) |
申请公布日期 |
2002.02.19 |
| 申请号 |
US19990472961 |
申请日期 |
1999.12.28 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CANAPERI DONALD F.;COTE WILLIAM J.;FEENEY PAUL;KRISHNAN MAHADEVAIYER;LIU JOYCE C.;LOFARO MICHAEL F.;MURPHY PHILIP;WHITE ERIC JEFFREY |
| 分类号 |
C09G1/02;C23F3/00;H01L21/321;(IPC1-7):C09G1/02;B24B1/00;C09G1/04 |
主分类号 |
C09G1/02 |
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