发明名称 WORK FIXING DEVICE
摘要 PROBLEM TO BE SOLVED: To form a thin and uniform adhesive layer at a designated pressure and in a short time. SOLUTION: This work fixing device is provided with a face plate having a work surface for bonding and fixing a work using a hot melt adhesive, a heating and cooling means for selectively heating and cooling the face plate, and one or more grooves formed in the work surface to receive surplus adhesive. When the work is pressed to the molten adhesive, surplus adhesive enters the near groove before being extruded to the end of the work.
申请公布号 JP2002052430(A) 申请公布日期 2002.02.19
申请号 JP20000238690 申请日期 2000.08.07
申请人 KANETEC CO LTD 发明人 MARUYAMA MASAAKI;HARUHARA KAZUO;TANAKA KIYOSHI;YOKOYAMA KOJI
分类号 B23Q3/08;B23Q3/18;(IPC1-7):B23Q3/08 主分类号 B23Q3/08
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