Method and apparatus for tooless mating of liquid cooled cold plate with tapered interposer heat sink

摘要

A heat dissipating apparatus for use on a heat generating electric component inside a computer comprises an interposer mounted on the heat generating electric component and a heat absorbing member including a heat absorber, a bracing member, and a spring biasing said heat absorber toward the bracing member. The heat absorbing member is moveable between a first position in which the interposer is compressed between the heat absorber and the bracing member and a second position in which the interposer is not compressed between the heat absorber and the bracing member.