| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method by which a metallic film can be deposited with high adhesion by ion plating on an organic substrate composed of insulator, such as printed wiring board. SOLUTION: The film deposition method is performed by using an ion plating apparatus which has a vacuum vessel 11, a pressure gradient type plasma beam generator 13 attached to the vacuum vessel, a main hearth 30 containing an vaporizable material and arranged in the vacuum vessel, and an auxiliary anode 31 consisting of an annular permanent magnet and an electromagnet coil and located around the main hearth. A resin substrate 1 as an object of film deposition is located opposedly to the main hearth. A metallic material is used as the vaporizable material held in the main hearth. Ion plating is carried out while applying AC power to the resin substrate 1 by an AC power source 4 from the surface on the side opposite to the main-hearth-side surface. |
