发明名称 METHOD FOR MANUFACTURING PACKAGING FILM WHICH CAN BE TORN IN SPECIFIC PLANAR FORM
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a packaging film which can be torn in a specific planar form along a formed curve to be cut by a means other than stretching a cut tape. SOLUTION: A film surface roughening tool is brought into sliding contact with a continuous film F1 and then is reciprocated in the transverse direction so that two continuous curves K1 and K2 to be cut are formed by scratching. The curves K1 and K2 are formed in such a manner that the interval between the curves K1 and K2 is narrow at a position where the curves K1 and K2 correspond to cut marks (m) printed on the film and the interval is wide at a position where the curves K1 and K2 are away from the cut marks (m).
申请公布号 JP2002052625(A) 申请公布日期 2002.02.19
申请号 JP20000239377 申请日期 2000.08.08
申请人 ONUMA KOJI;INAGAKI HIROMICHI 发明人 ONUMA KOJI;INAGAKI HIROMICHI
分类号 B65D85/50;B31B1/14;B65D30/28;B65D33/00;B65D65/10;B65D65/28;B65D65/30;B65D75/60;B65D85/36;(IPC1-7):B31B1/14 主分类号 B65D85/50
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