发明名称 |
Method of making chip scale package |
摘要 |
A method of making a chip scale package comprises the following steps: providing a semiconductor chip having a plurality of metal bumps formed on the active surface thereof; providing a metal plate having a plurality of flip-chip pads formed on a surface thereof; positioning the semiconductor chip on the surface of the metal plate with the metal bumps on the chip aligned with the flip-chip pads on the metal plate; connecting the metal bumps on the active surface of the semiconductor chip to the flip-chip pads on the surface of the metal plate; encapsulating the semiconductor chip against a portion of the surface of the metal plate; removing the metal plate while leaving the flip-chip pads intact; and forming a plurality of solder balls on the flip-chip pads. Using the technique of the present invention, it becomes possible that the manufacture of a molded chip scale package can be relatively simplified and economical, yet highly reliable.
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申请公布号 |
US6348399(B1) |
申请公布日期 |
2002.02.19 |
申请号 |
US20000610857 |
申请日期 |
2000.07.06 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIN CHUN HUNG |
分类号 |
H01L21/56;H01L21/68;H01L23/31;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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