| 摘要 |
PROBLEM TO BE SOLVED: To perform a high-precision film thickness control by using a film thickness control monitor and a characteristic monitor. SOLUTION: A dome 12 for holding a product substrate is provided above an evaporation source 11. Film thickness during film deposition is monitored by using a film thickness control monitor substrate 14 located at the center of the dome, and also final film thickness Dm after film deposition is measured. Further, a measured tooling (measured film thickness ratio) Ds/Dm is determined from film thickness Ds of a laminated film on a characteristic monitor substrate 13. Based on the resultant value, control wavelengths in the film thickness control monitor with respect to ensuing layers are altered.
|
