| 摘要 |
PROBLEM TO BE SOLVED: To provide a filler of high thermal conductivity, excellent in reliability while maintaining the high thermal conductivity of the raw material aluminum nitride sinter itself, and a resin composition for sealing a semiconductor, filled with the filler. SOLUTION: The filler of high thermal conductivity comprises a surface coated aluminum nitride sinter obtained by forming a boehmite film on the surface of an aluminum nitride sinter in such a manner that the number of OH groups is 2 to 5/nm2 and coating the film with a silane coupling agent. The resin composition comprises an epoxy resin filled with the filler.
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