| 摘要 |
PROBLEM TO BE SOLVED: To provide a low temperature curable resin composition which has excellent curability and adhesiveness in a low temperature region and does not leave tackiness on the surface of the cured product. SOLUTION: This low temperature curable resin composition comprising at least the following compounds (A), (B) and (C); (A) a thiirane compound obtained by substituting all or a part of oxirane rings of an epoxy compound by thiirane rings, (B) an amine based curing agent, and (C) a tertiary amine.
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