| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus for etching and the like by which a printed circuit board or the like capable of dealing with multi- function, high density, thinning of wire, and thinner shape is manufactured from a sheet-like material such as plastic film, glass fiber film, metal foil, or paper. SOLUTION: A substrate 3 can be precisely etched while being carried in a floating manner by using the porous type substrate treatment apparatus which is placed on the bottom side of the substrate 3 and performs the etching with an etching solution ejecting film 22 of a porous body 21 abutted on the lower side of the substrate 3. Even when the substrate 3 is a thin film, no wrinkles or dents are generated on the surface, or a very small conductor circuit pattern of the printed circuit board is not damaged because it is not brought into contact with any member of the apparatus. Because the etching solution discharge film 22 has no substrate carrying force, a carrier 24 such as a belt conveyor having a member 23 for pushing an end part of the substrate from behind can be provided on the symmetrical position of the substrate 3.
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