发明名称 LAMINATED PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a laminated packaging material which is suitable for packaging an electronic part and the like, shows excellent electrostatic shield and gas barrier properties and can be manufactured at a low cost. SOLUTION: A laminate packaging material 1 is provided with a base film 10, a vapor deposited ceramic layer 32 formed on one major surface of the base film 10, a vapor deposited metal layer 40 formed on the vapor deposited ceramic layer 32 and a heat sealable sealant layer 60 formed on the vapor deposited metal layer 40.
申请公布号 JP2002052642(A) 申请公布日期 2002.02.19
申请号 JP20010157331 申请日期 2001.05.25
申请人 TOPPAN PRINTING CO LTD 发明人 KURODA KENJIRO;SHIOKAWA SHUNICHI;IMAI NOBUHIKO
分类号 B65D65/40;B32B9/00;B32B15/04;B32B18/00;C23C14/06;C23C14/20;(IPC1-7):B32B9/00 主分类号 B65D65/40
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