发明名称 COMPOSITE DIELECTRIC SUBSTRATE AND PREPREG
摘要 PROBLEM TO BE SOLVED: To provide a composite dielectric substrate and prepreg therefor, comprising at least a resin and a glass cloth, increased in the dielectric constant of the prepreg, capable of miniaturizing and lightening substrates and electronic components and capable of miniaturizing built-in capacitors. SOLUTION: The prepreg and the substrate each has a structure comprising at least a resin, dielectric powder dispersed in the resin and a glass cloth, wherein the dielectric constant of the mixture of the resin and the dielectric powder is larger than the dielectric constant of the glass cloth and the glass cloth has <=60 g/m2 cloth weight and >=200 cm3/cm2/s air permeability.
申请公布号 JP2002053680(A) 申请公布日期 2002.02.19
申请号 JP20000239728 申请日期 2000.08.08
申请人 TDK CORP 发明人 KAWABATA KENICHI
分类号 C08J5/24;C08K3/00;C08K7/14;C08L101/00;H05K1/03;H05K3/46;(IPC1-7):C08J5/24 主分类号 C08J5/24
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