| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive resin composition that has excellent adhesion, resistance to soldering heat, resistance to heat aging, flexibility and a tack-free property and is useful for a flexible circuit board. SOLUTION: In the resin composition comprising (1) 100 pts.wt. of an epoxy resin bearing two or more epoxy groups in one molecule, (2) 20-200 pts.wt. of ethylene-acrylate copolymer rubber and (3) a curing agent, (a) an epoxy resin having a softening point of >=50 deg.C and (b) an epoxy resin having a softening point of <=50 deg.C are characteristically used in combination at a weight ratio (b)/(a)=0/100-80/20 as the epoxy resin component.
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