| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, having high soldering resistance, excellent flame retardancy and reliability in moisture resistance, and good flowability. SOLUTION: The epoxy resin composition for sealing a semiconductor contains (A) an epoxy resin mixture comprising an epoxy resin (X) having a biphenyl skeleton and an epoxy resin (Y) having a dicyclopentadiene skeleton represented by formula (1) (wherein R's may be the same or different and are each H, a halogen atom, or a 1-12C alkyl; and n is 0 or a positive integer), (B) a phenol resin, (C) a polyhedral metal hydroxide represented by the formula: M1-XQX(OH)2 (wherein M stands for at least one metal atom selected from the group consisting of Mg, Ca, Sn and Ti atoms; Q stands for at least one metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn atoms; and X is a positive number of 0.01 to 0.5), and (D) an inorganic filler.
|
