| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming via holes in an ink jet print head of bubble jet (R) system in which shortening of machining time, mass production, low cost, suppression of failure rate and uniform size can be realized. SOLUTION: A wafer arranged with a large number of substrates is partially sandblasted from the surface and rear to form wells at parts not covered with a mask and via holes are formed by conducting wells on the surface and rear. Sand is blasted such that a large number of substrates are included in a sandblasted region and a large number of wells are formed simultaneously while moving the wafer under a sanding machine. According to the method, shortening of machining time, mass production, and low cost can be realized. Furthermore, the size can be made uniform by blasting sand to a part covered with a mask and failure rate can be suppressed by protecting the substrate against damage. |
