发明名称 |
Method and system for utilizing multiple thermocouples to obtain a temperature contour map |
摘要 |
A system and method for detecting a location of a short in a flip-chip device is disclosed. The flip-chip device includes a semiconductor die and a substrate. The semiconductor die has an active area including a surface. The semiconductor die also has a plurality of connections coupled with the surface of the active area. The method and system include supplying power to the semiconductor die and sensing a temperature at a plurality of locations while power is supplied to the semiconductor die. The temperature is sensed at the plurality of locations using at least one thermal couple. The plurality of locations is disposed between the plurality of connections.
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申请公布号 |
US6348807(B2) |
申请公布日期 |
2002.02.19 |
申请号 |
US19980199840 |
申请日期 |
1998.11.24 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BLACK J. COURTNEY |
分类号 |
G01R22/04;G01R31/311;(IPC1-7):G01R31/26 |
主分类号 |
G01R22/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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