发明名称 VACUUM FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vacuum film deposition system by which deterioration in the adhesion of a deposited film to a substrate can be prevented in the case where the deposit film is formed on the sheet-like substrate at a prescribed temperature. SOLUTION: The vacuum film deposition system 1 is used for forming the deposit film on one main surface of a sheet-like substrate 8 and has a vacuum chamber 2, a substrate holder 3 provided in the vacuum chamber 2 and used for holding the substrate 8, an evaporation system 9 used for evaporating a deposit-film-forming material and arranged in the vacuum chamber 2 in a manner to face one main surface of the substrate 8 held by the substrate holder 3, a heating equipment 20 for heating the other main surface of the substrate 8 held by the substrate holder 3, and a heating light irradiation system 105 for irradiating one main surface of the substrate 8 held by the substrate holder 3 with beam-shaped heating light 14.
申请公布号 JP2002053947(A) 申请公布日期 2002.02.19
申请号 JP20000235377 申请日期 2000.08.03
申请人 SHIN MEIWA IND CO LTD 发明人 HAJI YASUHIRO;TAKEUCHI KIYOSHI;KOIZUMI YASUHIRO;OGAWA KENICHI
分类号 C23C14/24;(IPC1-7):C23C14/24 主分类号 C23C14/24
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