发明名称 METHOD FOR NITRIDING SUBSTRATE CONTAINING ALUMINUM METAL
摘要 PROBLEM TO BE SOLVED: To suppress the dispersion of the state of formation of a nitride film and to accelerate the formation of the nitride film in forming the nitride film on a substrate containing aluminum metal. SOLUTION: A substrate containing at least aluminum metal is heat-treated in a vacuum of <=10-3 Torr. In succession to this heat treatment, nitriding treatment is applied under heating in an atmosphere containing at least nitrogen to form the nitride film. In this method, a porous body through which gas containing nitrogen atoms can be allowed to flow is heated under <=10-4 Torr pressure to carry out cleaning treatment, and then the porous body is brought into contact with the above-mentioned atmosphere at the nitriding under heating.
申请公布号 JP2002053944(A) 申请公布日期 2002.02.19
申请号 JP20000234302 申请日期 2000.08.02
申请人 NGK INSULATORS LTD 发明人 WATANABE MORIMICHI;KAWASAKI SHINJI;ISHIKAWA TAKAHIRO
分类号 C23C8/02;C23C8/24;(IPC1-7):C23C8/24 主分类号 C23C8/02
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