Navigation using 3-D detectable pattern

摘要

According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device to expose a selected region in the substrate, wherein the semiconductor device has a grid formed in the device to provide lateral and depth position indication during an etch/milling process. In an example implementation, the grid is three dimensional and is used during device analysis for navigation while removing substrate to access a selected circuit area via the backside of flip-chip device. As substrate is removed, the tools are aligned as indicated by the grid.