| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent connection failure, and at the same time to achieve the high density of not only an upper thin-film circuit but also thick-film one by providing a matching layer that absorbs the misalignment between circuits at the interface between a thick-film wiring board and a thin-film wiring circuit formed at the upper portion and electrically connects terminals. SOLUTION: A ceramic thick-film wiring board 10 is equipped with five aluminum substrates 11, an inner-layer conductor 12 and an alignment mark 15 of a surface are printed by paste such as tungsten and molybdenum on such aluminum substrate 11, and a via part 13 is formed in the thick-film wiring board 10. On the backside of the thick-film wiring board 10, a land 14 is formed while the via part 13 being exposed from the backside is covered. Also, on the surface of the thick-film wiring board 10, a connection conductor pad 16 is formed while electric connection is made to the via part 13 being exposed from the surface. The connection conductor pad 16 can be used as a matching layer 62 for carrying out the matching connection between a conductor 22 for wiring in a thin-film wiring board 20 being formed on the pad and the via part 13.</p> |
