发明名称 METHOD FOR REGENERATING ETCHING SOLUTION FOR PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for regenerating an etching solution for a printed circuit board capable of contributing to the reduction in the production cost of a printed circuit board and environmental protection by utilizing ozone produced in a UV ink hardening furnace as an oxidizer instead of an oxidizer such as a hydrogen peroxide aqueous solution. SOLUTION: In the method for regenerating an etching solution in which cuprous chloride contained in an etching solution after the etching of a printed circuit board is reduced into cupric chloride by an oxidizer and is reutilized, as the above oxidizer, ozone is used. In this case, as the ozone, preferably, the one produced an captured by a UV ink hardening furnace used in the production process of a printed circuit board is used. Further, the shortage of the ozone can be compensated for by a purchased oxidizer such as a hydrogen peroxide aqueous solution.
申请公布号 JP2002047585(A) 申请公布日期 2002.02.15
申请号 JP20000230167 申请日期 2000.07.31
申请人 ELNA CO LTD 发明人 ISHIKAWA RYOICHI
分类号 C23F1/46;H05K3/06;(IPC1-7):C23F1/46 主分类号 C23F1/46
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