发明名称 THERMAL FUSE
摘要 PROBLEM TO BE SOLVED: To provide a thermal fuse which can be miniaturized and is excellent in insulation. SOLUTION: The electrode patterns 3A and 3B are formed on the surface 2A and the back 2B of an insulating substrate, a hole is provided in an optional position between the electrode patterns 3A and 3B, a soluble alloy 4 having a low melting point is welded to the hole, both ends of the soluble alloy 4 are bridged to each electrode pattern 3A and 3B, the soluble alloy 4 is coated with a rosin flux, and the conducting leads 7A and 7B each are connected with the electrode pattern 3A and 3B, respectively. All these things mentioned above are put together into the insulating case 8 through the aperture 9, the conducting leads 7A and 7B are projected out of the insulating case 8, and then the aperture 9 is sealed with an epoxy resin. Thus, the thermal fuse 1 is obtained.
申请公布号 JP2002050270(A) 申请公布日期 2002.02.15
申请号 JP20000238459 申请日期 2000.08.07
申请人 ANZEN DENGU KK 发明人 KATSUMOTO NORIYUKI;KATO SHINICHI
分类号 H01H37/76;(IPC1-7):H01H37/76 主分类号 H01H37/76
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