SEMICONDUCTOR DEVICE WITH A HEAT SINK AND METHOD OF PRODUCING THE HEAT SINK

摘要

A semiconductor device (3) with a convex heat sink (4A) comprises: a semiconductor element (3) disposed within a space formed by leads of a lead frame (1), the semiconductor element (3) having bonding pads connected to the leads through wires (5) respectively; a convex heat sink (4A) made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads (1), the semiconductor element (3) being disposed at a center portion of the heat sink (4A); an insulator (2A) disposed on the leads (1) and for bonding and fixing the semiconductor element (3) to the heat sink (4A); and a package of resin (6) for sealing except part of the leads (1) and the top surface of a projecting portion of the heat sink (4A); wherein the insulator (2A) has a shape like a tape so as to cover part of the leads (1) and extend along a bottom surface near a circumferential edge of the heat sink (4A), and the side surface of the projecting portion of the heat sink (4A) is scraped out into a curved surface.