发明名称 BUMP-BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To transmit high frequency ultrasonic vibration to a capillary, with high transmission efficiency in a bump-bonding device. SOLUTION: This bump-bonding device is equipped with an ultrasonic horn 40, whose base edge side is connected to a vibration generation source 43 and whose tip side retains the capillary 45, and a horn holder 39 that removably mounts the ultrasonic horn 40 to a bonding arm 37. In the ultrasonic horn 40, the contour of a section orthogonally crossing an axis L from the end part of the base edge side to a part, where the capillary 45 is retained, is composed by one closed line. The horn holder 39 has horn support projections 39m, 39n, and 39p at a position P1, corresponding to the node of the longitudinal wave of the ultrasonic vibration in the direction of the axis L of the ultrasonic horn 40. The horn support projections 39m, 39n, and 39p allow constraint force to act in the radial direction of the ultrasonic horn with respect to three places in the circumferential direction of the ultrasonic horn 40.
申请公布号 JP2002050649(A) 申请公布日期 2002.02.15
申请号 JP20000238311 申请日期 2000.08.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SASAOKA TATSUO;YONEZAWA TAKAHIRO;KIYOMURA HIROYUKI;TOKUNAGA TETSUYA;HASHIMOTO MASAHIKO
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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