| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for coating a circuit board which can cure photosetting resin efficiently. SOLUTION: The method for coating the circuit board including a resist process for forming a resist layer for protecting a wiring pattern on the surface of a board, a mounting process for soldering electronic parts to the surface of the board where the resist layer is formed, a process for closely fitting a frame member having an opening part formed so as to correspond to a prescribed area, which has to be coated with the photosetting resin, to the surface of the board where the electronic parts are mounted, a process for injecting the photosetting resin to the opening part, a process for photosetting the photosetting resin by irradiating it with light from over the frame form member and a process for removing the frame form member additionally includes a printing process for forming a white ink layer on the resist layer between the resist process and the mounting process.
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