| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel TAB tape, superior in adhesion and soldering heat resistance and a semiconductor device, using the same. SOLUTION: The adhesive sheet for semiconductor devices has a laminate, composed of at least one protective film layer and an adhesive layer. The adhesive layer contains a thermoplastic resin (A), an epoxy resin (B) and a hardening agent (C). The resin (B) contains at least a compound expressed by a general formula (1) (wherein at least one of R1-R8 contains a glycidyl group, at least one of R1-R8 coupled with paraxylene, other R1-R8 each designate hydrogen atom, 1C-4C lower alkyl group or halogen atom and may be equal or different, and n is integer 0-10).
|
