| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic components, where an IC chip is connected firmly to a container, furthermore, stresses applied to the IC is decreased, when resin that is filled, cured, and formed at the lower and peripheral parts of the IC chip is heated and cooled in a later process, and abnormalities in operation and failures in connection are reduced. SOLUTION: In the electronic component 10, an IC element having a conductive bump 3 on a lower surface is jointed to the container 1, having a cavity 2b that accommodates the IC element and forms an electrode pad 6 on a bottom surface 20, and at the same time, a thermosetting resin 5 is filled and cured in remaining space inside the cavity 2b. In this case, a groove part 1d which is formed at the corner part between the bottom surface 20 and inner-wall surface of the cavity of the container 1.
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