| 摘要 |
PROBLEM TO BE SOLVED: To provide a sample, for moisture absorption measurement, which can enhance the reliability of an electronic component by quantitatively controlling the moisture absorption of the electronic component, to provide a measuring method for the moisture absorption of the electronic component and to provide a mounting method for the electronic component. SOLUTION: In the mounting method for the electronic component, a relationship between the storage environment, the moisture absorption rate, the reflow heat resistance and the relaibility of the electronic component is grasped (S1), a mounting condition which satisfies the guarantee condition of a component maker and which is suitable for the guarantee condition of a user is set (S2), the sample for moisture absorption measurement is packed in every package unit of the electronic component, its mass is attached so as to be shipped (S3), the mass of the sample for moisture absorption measurement is measured, and the moisture absorption rate of the electronic component is quantitatively controlled (S4).
|
