MODULE ELECTRONIQUE DE PUISSANCE ET PROCEDE DE FABRICATION D'UN TEL MODULE

摘要

The module including an aluminum-based metal substrate (10) and at least one copper-based bar (12) constituting an equipotential connection which is fixed to the substrate via an insulating layer. A power component (16) is in direct contact with the bar via a surface area that is smaller than the area of the insulating layer. A printed circuit card (18) mounted on the bar(s) and projecting therefrom carries low heat-dissipation components of the module.