SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce the cost for the chip burn-in. SOLUTION: A semiconductor chip 1 has a plurality of connecting pads 1b provided on an inner region of a main surface 1a as outer terminals for inspecting the chip operation and a plurality of larger burn-in electrodes 1c provided on a peripheral region of the main surface than the connecting pads 1b at wide pitches. The chip 1 is mounted in a socket provided on a burn-in substrate to directly contact the burn-in electrodes 1c of the chip 1 to terminals of the socket, thereby executing the chip burn-in for selection. The cost of the chip burn-in can be reduced.