发明名称 METHOD AND DEVICE FOR PROCESSING SURFACE OF MULTILAYER PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To provide a surface processing method for a multilayer printed board for quick and effective surface processing. SOLUTION: A high-frequency power source 21 causes corona a discharge between a first electrode 22 and a second electrode 24. The electric discharge generated at the first electrode 22 converges in a conductive layer 102 exposed within a hole 104 to remove a smear 105 remaining inside the hole 104. A part of the electric discharge generated from the first electrode 22 is made to irradiate on the hole formation surface of a board 100, allowing the hole formation surface to be hydrophilic. With this processing method, a dielectrics 23 coated on the first electrode 22 functions as an aggregate of micro capacitors so that no electric discharge is converged on a specific position, giving no damage on the hole formation surface and the like.
申请公布号 JP2002050872(A) 申请公布日期 2002.02.15
申请号 JP20000234630 申请日期 2000.08.02
申请人 HAMAMATSU PHOTONICS KK 发明人 TAKAOKA HIDEJI;KANBE KAZUYUKI;OYA TOMONORI
分类号 C23C18/18;H05K3/00;H05K3/26;H05K3/46;(IPC1-7):H05K3/46 主分类号 C23C18/18
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