| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow method by which the temperature fluctuation can be reduced to the utmost at the time of reflow. SOLUTION: Even when a film substrate 15 elongates due to thermal expansion when a heater block 18 heats paste-like solder 16, the solder 16 can be heated uniformly, because the hot air from a hot air blowing-out port 20 enters into portions apart from the heater block 18 and flows around the whole lower surface of the substrate 15 in the area where a group of chip parts 17 is mounted. Therefore, the solder 16 is surely heated to cause reflow and the parts 17 can be soldered to the substrate 15. |
