| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which can prevent peeling of a lead terminal from the bottom plate of an enclosure form case as well as is capable of deal with the miniaturization of the electronic devices. SOLUTION: An electronic component which is composed of a resin made enclosure form case 1 with a bottom plate 3 and a sidewall 5 and opened at the top and housing an electronic device A, and a plurality of belt form lead terminals 7a attached by integral molding to the lower side of the plate 3 of the case 1. A bonding reinforcement part 7b is formed on each facing side of the terminal 7a of both ends, and a tip part 7c of the part 7b is derived to the upper side of the plate 3 and is connected electrically to the device A.
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